Globetronics Technology Bhd (“GTB”), an established player in the Outsourced Semiconductor Assembly and Test (“OSAT”) and semiconductor industry, is pleased to announce a strategic partnership with ChipMOS Technologies Inc. (“ChipMOS”), a renowned provider of semiconductor assembly and testing services headquartered in Taiwan.
ChipMOS is a global leader, listed in both Taiwan and Nasdaq, in semiconductor assembly and testing services, specialising in memory and mixed-signal integrated circuit testing and advanced packaging with a total issued share capital of RM3.33 billion comprising 727,301,092 ordinary shares.
Headquartered in Taiwan, ChipMOS serves a wide array of international customers in the semiconductor supply chain, providing tailored solutions to meet their precise needs.
Under the agreement, GTB will provide cutting-edge dicing, packaging, and testing services for integrated circuit products delivered by ChipMOS.
ChipMOS, as the supplier of these products, will be responsible for furnishing GTB with the necessary wafers, detailed specifications, and production forecasts to facilitate efficient processing. This partnership is expected to strengthen both companies’ capabilities in semiconductor backend services, enabling the delivery of high-quality solutions to meet the growing demands of the global market.
This collaboration leverages the strengths of both GTB’s advanced packaging and testing expertise and ChipMOS’s market leadership in integrated circuit manufacturing.
The agreement outlines a commitment to rigorous quality control, efficient processing methods, and flexibility to meet evolving market demands and customer requirements.
With a total estimated contract value for the three-year agreement amounting to a minimum of RM145 million, this partnership aims to enhance production efficiency and product quality, solidifying their competitive positions in the semiconductor supply chain.
The Management of Globetronics Technology Bhd commented,
“We are thrilled to collaborate with ChipMOS on this exciting venture. This partnership underscores our shared commitment to advancing semiconductor innovation and delivering best-in-class solutions to our customers. By combining our expertise, we are confident in our ability to address the evolving challenges of the semiconductor market and drive mutual growth.”
The partnership between Globetronics Technology Bhd and ChipMOS is expected to contribute significantly to the semiconductor ecosystem by integrating innovative solutions and optimising operational efficiencies.
With this collaboration, GTB reinforces its position as a key player in the semiconductor sector, committed to driving value for its stakeholders and advancing Malaysia’s standing in the global technology arena.
For more information, please visit http://www.globetronics.com.my/
